Focusing on Solving Technical Problems
Analyze To Succeed !

Semiconductor Device Failure Analysis Electronic Device Failure Analysis Electrical Failure Analysis Metallurgical Failure Analysis Printed Circuit Board (PCB) Failure Analysis Package Decapsulation Cross-Sectioning Parallel and Angle Lapping Sequential Stripback Destructive Physical Analysis (DPA) Detection and Analysis of Counterfeit Electronic Components Dye & Pry Test Mechanical Tests Optical Microscopy X-ray Radiography Scanning Electron Microscopy (SEM) Emission Microscopy X-ray Energy Dispersive Spectroscopy (XED) Auger Electron Spectroscopy (AES) Secondary Ion Mass Spectroscopy (SIMS) Atomic Force Microscopy (AFM) Focused Ion Beam (FIB) Scanning Capacitance Microscopy (SCM) Semiconductor Structure Characterization Fiberoptic Component Characterization Solid State Laser Characterization Micro Electro Mechanical System (MEMS) Characterization

Electrical Characterization Voltage Contrast Optical Beam Induced Current (OBIC) Electron Beam Induced Current (EBIC) Electrostatic Discharge Sensitivity Test (ESD) Latchup Evaluation Focused Ion Beam (FIB) Circuit Modification FIB Electrical Troubleshooting Dielectric Integrity Tests Hot Spot Detection Circuit Extraction Capacitance-voltage (CV) characterization and plot 1/f noise measurements and characterization s-parameters measurements, fT and fmax measurements (on wafer or on packaged parts) SPICE Modeling Service   more ... SPICE Models Extraction and Validation  more ... Statistical SPICE Models Extraction and Validation  more ... Best/Worst Case SPICE Models Extraction and Validation   more ... SPICE Corner Models Extraction and Validation   more ... Circuit SPICE Simulations   more ... Intellectual Property (IP) Technical Consulting Patent Litigation Technical Consulting MIL-STD Certifications